Niigata, Japan
www.welcon.co.jp Booth number
Company profile:
WELCON Inc. is a comprehensive provider of design, modeling, prototyping, evaluation, and manufacturing services for complex components that simply cannot be made by machining process. Using diffusion bonding technology, WELCON works closely with its customers to optimize the design and fabrication of 3D hollow structure parts. Diffusion bonding opens up a whole new approach of the design and fabrication.

Exhibits at HANNOVER MESSE 2018:
Diffusion bonding based 3D components provider
High efficient micro channel heat exchanger & heat sinks
pre-cooler / inter cooler solutions

Product category:
Components and supplying technology
Technical Forum
Topic: Diffusion bonded micro-channel compact pre-cooler for hydrogen station
Speaker: Ken Taoka, COO / Marketing Director
Date: Wednesday, April 25, 13:00

Booth photos

View the online documentation from HANNOVER MESSE 2017